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Black HASL Lead Free 4 Layers 1.6mm BGA PCB Assembly

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Shenzhen Shinelink Technology Ltd

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Black HASL Lead Free 4 Layers 1.6mm BGA PCB Assembly

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Brand Name :	Shinelink
Model Number :	SL0925S03
Certification :	UL, Rohs
Price :	Negotiable
Payment Terms :	L/C, T/T, Western Union, MoneyGram
Supply Ability :	5000 Piece/Pieces per Day
Delivery Time :	7-12 days

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Product Details
Company Profile

Black HASL Lead Free 4 Layers 1.6mm BGA PCB Assembly

HASL Lead Free 4 Layers Assembly BGA Round Black 1.6mm Thickness

SHINELINK is an electronics manufacturing services (EMS) supplier located in Shenzhen, China. We provide customers with flexible and reliable electronic manufacturing services, including parts procurement, circuit board processing, DIP, through-hole soldering, PCBA testing, box assembly, packaging and logistics. We support customers to arrange the quantity according to the actual needs. There is no MOQ, of course, the more quantities order, the more competitive the price get.

Files Requested For PCB Assembly Quotation

---In order to provide you with the most efficient and accurate quote on manufacturing the requested unit, we ask that you provide us with the following information.
1. Gerber file,PCB file,Eagle file or CAD file are all acceptable
2. A detailed bill of materials (BOM)
3. Clear pictures of PCB or PCBA sample for us
4. Quantity and delivery required
5. Test method for PCBA to guarantee 100% good quality products.
6. Schematics file for PCB design if need to do function test.
7. A sample if available for better sourcing
8. CAD files for enclosure manufacturing if required
9. A complete wiring and assembly drawing showing any special assembly instructions if required

Shinelink kinds PCBA product

94V0 PCBA manufacture Scale capabilities up to
We combine advanced processes with highly skilled resources. Keeping up with the leading advanced technology and management system in One-stop services of PCB assembly

SMT process (RoHs Compliant) Capabilities up to:
1. 0201 Chip Size
2. 12 mils Integrated Circuit (IC) Pitch
3. Micro Ball Grid Array (BGA) – Pitch 16 mils
4. Flip Chip (Controlled Collapse Chip Connection) – Pitch 5 mils
5. Quad Flat Package (QFP) – Pitch 12 mils

THT(Wave soldering) process (RoHs Compliant) Capabilities up to:

1.Single side wave soldering
2.SMT & THT mixture process
Rigid 1oz Copper PCBA Board Assembly PCB 2 Layer ODM PCBA Immersion Gold

PCB Assembly Capabilities

Turnkey PCBA	PCB+components sourcing+assembly+package
Assembly details	SMT and Thru-hole, ISO lines
Lead Time	Prototype: 15 work days. Mass order: 20~25 work days
Testing on products	Flying Probe Test, X-ray Inspection, AOI Test, functional test
Quantity	Min quantity: 1pcs. Prototype, small order, mass order, all OK
Files we need	PCB: Gerber files(CAM, PCB, PCBDOC)
	Components: Bill of Materials(BOM list)
	Assembly: Pick-N-Place file
PCB panel Size	Min size: 0.250.25 inches(66mm)
PCB panel Size	Max size: 2020 inches(500500mm)
PCB Solder Type	Water Soluble Solder Paste, RoHS lead free
Components details	Passive Down to 0201 size
	BGA and VFBGA
	Leadless Chip Carriers/CSP
	Double-sided SMT Assembly
	Fine Pitch to 0.8mils
	BGA Repair and Reball
	Part Removal and Replacement
Component package	Cut Tape,Tube,Reels,Loose Parts
PCB assembly process	Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

PCBA Picture

Black HASL Lead Free 4 Layers 1.6mm BGA PCB Assembly

FAQ:

1. What factors should be considered when choosing the material for a PCB board?
Below factors should be considered when we choose the material for PCB:
The material’s Tg value should be greater than the operation temperature;
Low CTE material has good performance of thermal stability;
Good thermal resistance performance: Normally PCBs are required to resist 250℃ for at least 50s.
Good flatness; In consideration of the electrical properties, low loss/high permittivity material is used on high frequency PCB; Polyimide glass fiber substrate used for flexible PCB; Metal core is used when the product has strict requirement of heat dissipation.

2. What’s the merits of O-leading's rIgid-flex PCB?
SHINELINK’s rigid-flex PCB has the characters of both FPC and PCB, so it can be used in some special products. Some part is flexible while the other part rigid, it can help save product’s interior space, reduce product volume and improve performance.

3. How to you make the impedance calculation?
The impedance control system is done using some test coupons, the SI6000 soft and the CITS 500s equipment from POLAR INSTRUMENTS.
The equipment measures the impedance on a representative track configuration coupon of which the client has given us a determinate value and tolerance.

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